|
IC Advanced Packaging Industry Report, 2009
|
Caracteristicas de este estudio de mercado: | 189 paginás | |||||||||
| Sobre este articulo de mercado: |
The semiconductor industry is in the era of 32nm process, and it is expected that it will meet 16nm around 2019. Designing a 45nm SoC costs USD20-50 million except labor cost, and the design of a 32nm.....
The semiconductor industry is in the era of 32nm process, and it is expected that it will meet 16nm around 2019. Designing a 45nm SoC costs USD20-50 million except labor cost, and the design of a 32nm SoC costs USD75-120 million, while it is less than USD5 million for 130nm. Therefore, even if the IC design companies with annual revenue of over USD2 billion probably can not afford such high cost, and there are no more than ten such companies all over the world, which means that the majority of IC design companies are disqualified to enter 45nm or 32nm era. Perhaps the semiconductor industry will develop at the pace of Moore’s Law. Having made up for the bottleneck of process shrinkage, the packaging industry will yield unusually brilliant results in post-Moore’s Law era. In practice, the packaging industry has become increasingly important since 2000, and the debut of BGA, FC and CSP has sped up the progression of semiconductor industry. However, the front-end of semiconductor manufacturing has been in stagnancy, still in the era of 12-inch wafer, and it is likely that 15-inch wafer era will not come. Currently, a revolutionary packaging, TSV packaging presents itself, which is so called 3D IC. The technology will dramatically improve chip transistor density, cubic density rather than plane density, and make semiconductor industry surpass the development pace of Moore’s Law. Not only packaging companies and wafer OEMs, but also nearly all global prominent semiconductor companies such as IBM, Samsung, Intel and Qualcomm are all actively developing TSV technology. TSV has been in large shipment in image sensor and MEMS field, and it will rapidly expand to memory field in the future, and to DSP, RF IC, cell phone baseband, processor, CPU and GPU in 2013. Furthermore, TSV market size will rise to over US$2 billion from less than US$ 300 million currently, which will be the rapidest growing field in semiconductor industry. In the meantime, the advanced packaging has an increasingly powerful driving force. IC advanced packaging mainly refers to IC substrate packaging, including BGA, CSP, FC and LGA, and it mainly applies for cell phone, memory, PC (CPU, GPU and Chipest), network communications, and consumer electronics. In addition, the network communications include high-speed switch, router and base station. Consumer electronics are as the followings such as game console, IPOD, ITOUCH, and high-end PMP. The cell phone has more and more powerful functions, thinner and thinner in size; and the smart phones have covered a rising ratio. In the field of memory, DDR3 has become the mainstream, with the rate increased to over 1GHz; CPU has multi-cores, and the number of pins has exceeded 1,200. China’s 3G and the world’s 4G network distribution has boosted up the sales of base stations. The stay-at-home economy has made game machine shipment increase sharply as well. Japan and Taiwan have almost dominated IC packaging industry. Among the global top 12 companies, seven of which are from Taiwan, two from Japan, two from the United States, and one from South Korea. Report Highlights [Cerrar las informaciones del articulo de mercado] |
|||||||||||
|
1 Status Quo and Future of IC Advanced Packaging 1.1 IC Packaging Overview 1.2 IC Packaging Types 1.2.1 SOP 1.2.2 QFP and LQFP 1.2.3 FBGA 1.2.4 TEBGA 1.2.5 FC-BGA 1.2.6 WLCSP 1.3 Future Star – TSV Packaging 1.3.1 TSV Intro 1.3.2 Why is TSV rather than SoC 1.3.3 TSV Development 1.3.4 TSV Industry and Market 2 IC Advanced Packaging Market 2.1 Cell Phone IC Advanced Packaging Market 2.2 Cell Phone Baseband Packaging 2.2.1 Cell Phone Baseband Industry 2.2.2 Cell Phone Baseband Packaging 2.3 Cell Phone (Mobile) Application Processor 2.3.1 Definition 2.3.2 Market and Industry 2.4 Smart Phone Processor Industry and Packaging 2.5 Cell Phone Embedded Memory 2.5.1 Overview 2.5.2 Cell Phone Memory Development 2.5.3 Cell Phone Memory Industry and Packaging 2.6 Cell Phone RF IC 2.6.1 Market 2.6.2 Industry 2.6.3 3G/4G-era Cell Phone RF IC Packaging 2.7 Other Cell Phone IC 2.8 Cell Phone Market and Industry 2.8.1 Market 2.8.2 Industry 2.8.3 China’s Smart Phone Market 2.9 Advanced Packaging in PC Field 2.9.1 DRAM Industry 2.9.2 DRAM Packaging 2.9.3 NAND Flash Industry 2.9.4 NAND Flash Packaging Development 2.9.5 CPU, GPU & North and South Bridge Chipset 2.10 Image Sensor 3 Advanced Packaging Industry 3.1 Industry Scale 3.2 Industry Patterns 3.3 Comparison of Manufacturers 4 Advanced Packaging Manufacturers 4.1 TESSERA 4.2 Greatek 4.3 Formosa 4.4 ASE 4.5 AMKOR 4.6 SPIL 4.7 STATS ChipPAC 4.8 PHOENIX 4.9 Nanya 4.10 Kinsus 4.11 PowerTech 4.12 ChipMOS 4.13 King Yuan Electronics 4.14 IBIDEN 4.15 SHINKO 4.16 CARSEM 4.17 UNISEM 4.18 NEPES 4.19 STS 4.20 SEMCO 4.21 Unimicron 4.22 Chipbond 4.23 Changjiang Electronics Technology [Cerrar la tabla de contenidos] |
||||||||||||
|
IC Packaging Development Course, 1980-2010 SOP and TSSO Outline and Cross-sectional Diagram QFP, LQFP, HQFP Packaging Outline and Cross-sectional Diagram FBGA Outline and Cross-sectional Diagram FBGA Development Roadmap, 2006-2012 TEBGA Outline and Cross-sectional Diagram FC-BGA Outline and Cross-sectional Diagram FC-BGA Development Roadmap, 2006-2012 WL-CSP Outline, Manufacturing Flow and Cross-sectional Diagram Via First TSV Sketch-map Via Last TSV Sketch-map TSV Roadmap, 2005-2015 TSV Application Roadmap TSV Via Size Roadmap TSV Industry Layout TSV Wafer Shipment by Application, 2006-2014 Typical Cell Phone Block Diagram Market Shares of Global Cell Phone Baseband Manufacturers' Shipment, 2007-2009 Market Shares of China’s Cell Phone Baseband Manufacturers, 2009 Processor Marker Scale Forecast by Type, 2008-2012 Market Shares of Main Non-Smart Phone Processor Manufacturers by Sum, 2008 Market Shares of Main Smart Phone Processor Manufacturers, 2009 Cell Phone Embedded Memory Development Roadmap Cell Phone NOR Memory Demand (Mb), 2004-2012 Cell Phone RAM Memory Demand (Mb), 2004-2012 Cell Phone NAND Memory Demand (Mb), 2004-2012 Market Shares of Main Cell Phone Memory Manufacturers, 2009 Cell Phone Single-chip Memory Packaging Trend, 2007-2010 SIP Cell Phone Memory Packaging Development Trend, 2007-2011 PoP Cell Phone Memory Development Trend, 2007-2011 Global Cell Phone RF Market Scale, 2003-2010E Global 3G Cell Phone Distribution by Band Number, 2009-2013 Market Shares of Global Main Cell Phone RF Transceiver Manufacturers by Shipment, 2008 Market Shares of Global Main Cell Phone PA Manufacturers by Sum, 2008 Comparison of Main PA Manufacturers’ Technology Capabilities Intel CPU Development Trend, 2009-2011 PC Shipment, 2006-2013E Early Cell Phone Camera Module Sketch-map Cell Phone Camera Module with TSV Packaging Cell Phone Camera Module Industry Chain CMOS Image Sensor Shipment, 2008-2013 Market Shares of Main CMOS Image Sensor Manufacturers, 2009 Market Shares of Cell Phone Camera Module Assembly Manufacturers Market Shares of Main Cell Phone Camera Optics Lens Manufacturers TSV Roadmap of CMOS Image Sensor Global IC Packaging Shipment by Type, 2007 Global IC Packaging Shipment by Type, 2012 Global IC Packaging Sum by Type, 2007 Global IC Packaging Sum by Type, 2012 Downstream Distribution of Global Advanced Packaging Industry , 2009 Regional Distribution of Global Advanced Packaging Industry, 2009 Market Shares of Main Global Advanced Packaging Manufacturers in Cell Phone Field, 2009 Market Shares of Main Global Advanced Packaging Manufacturers in Laptop Field, 2009 Market Shares of Main Global Advanced Packaging Manufacturers in Memory Field, 2009 Market Shares of Main Global Advanced Packaging Manufacturers in Network Communication, 2009 Market Shares of Main Global Advanced Packaging Manufacturers in Consumer Electronics, 2009 TESSERA Business Distribution TESSERA’s Patent Number, 2000-2009Q2 TESSERA’s Revenue, 2004-2008 TESSERA’s Main Clients TESSERA’s Presence Worldwide Revenue and Gross Profit Margin of Greatek Electronics, 2002-2012 Organization Structure of Greatek Electronics Revenue of Greatek Electronics by Packaging Technology, 2007-2008 Formosa’s Revenue and Gross Profit Margin, 2002-2012 Formosa’s Organization Structure Formosa’s Revenue by Product, 2009 ASE’s Revenue and Gross Profit Margin, 2001-2010 ASE ‘s Organization Structure ASE’s Revenue and Gross Profit Margin, 2007Q1-2009Q2 ASE’s EBITDA and Investment Amount, 2007Q1-2009Q2 ASE’s Packaging Revenue and Gross Profit Margin, 2007Q1-2009Q2 ASE’s Packaging Revenue by Product, 2007Q1-2009Q2 ASE Test Department’s Revenue and Gross Profit Margin, 2007Q1-2009Q2 ASE Test Department’s Revenue by Technology, 2007Q1-2009Q2 ASE Product Downstream Application, 2005Q4, 2007Q2, 2008Q1 and 2009Q2 ASE’s Core Test Technologies Amkor’s Revenue and Gross Profit Margin, 2007Q1-2009Q2 Amkor’s Expenditure Ratio by Item, 2007Q1-2009Q2 Amkor’s Revenue by Division, 2008Q1-2009Q2 Amkor’s Product Downstream Application, 2008Q1-2009Q2 Amkor’s IC Shipment by Packaging Type, 2008Q1-2009Q2 Amkor’s Output Utilization Rate and Customer Concentration, 2008Q1-2009Q2 SPIL’s Organization Structure SPIL’s Revenue and Gross Profit Margin, 2003-2010 SPIL’s Revenue by Region, 2005Q4, 2007Q2, 2009Q1 & 2009Q2 SPIL’s Product Downstream Application Structure, 2005Q4, 2007Q2, 2009Q1 & 2009Q2 SPIL’s Product Structure by Technology Type, 2005Q4, 2007Q2, 2009Q1 & 2009Q2 StatsChipPAC’s Revenue and Gross Profit Margin, 2004-2009 StatsChipPAC’s Revenue by Division, 2006-2009Q2 StatsChipPAC’s Product Downstream Application Ratio, 2006-2009Q2 StatsChipPAC’s Revenue by Region, 2006-2009Q2 PHOENIX’s Organization Structure PHOENIX’s Revenue and Gross Profit Margin, 2003-2010 PHOENIX’s Product Structure, 2008Q1-2009Q2 PHOENIX’s Product by Layer, 2008Q1-2009Q2 PHOENIX’s Product Downstream Application Ratio, 2008Q1-2009Q2 PHOENIX’s Revenue by Region, 2007Q1-2009Q2 PHOENIX’s Staff Structure Nanya’s Revenue and Gross Profit Margin, 2003-2010 Nanya's Circuit Board Revenue Structure, 2007, 2008 & 2009Q2 Nanya’s Circuit Board Product Downstream Application Ratio, 2009Q2 Kinsus’ Revenue and Gross Profit Margin, 2001-2010 Kinsus’ Revenue, Jul, 2008-Jul, 2009 Kinsus’ Product Downstream Application Ratio, Jan-Jul, 2009 Ratios of Main Clients’ Contribution to Kinsus Revenue, 2007H1 Kinsus’ Products by Technology, 2007-2009 PowerTech’s Revenue and Gross Profit Margin, 2005-2010 ChipMOS Organization Structure ChipMOS Revenue and Gross Profit Margin, 2001-2009 ChipMOS Revenue by Region, 2006-2008 ChipMOS Revenue by Division, 2006-2008 ChipMOS Memory Revenue, 2001-2007Q3 ChipMOS Flash Memory Revenue, 2006Q1-2007Q3 ChipMOS LCD Driver IC Revenue, 2001-2007Q3 Revenue and Gross Profit Margin of King Yuan Electronics, 2003-2010 Organization Structure of King Yuan Electronics Revenue of King Yuan Electronics by Process, 2007Q3 Revenue of King Yuan Electronics by Product, 2007Q3 Product Downstream Applications of King Yuan Electronics, 2007Q3 IBIDEN’s Revenue and Operation Profit Margin, 2004-2008FY IBIDEN’s Revenue by Division, 2004-2008FY IBIDEN’s Revenue by Region, 2004-2008FY IBIDEN’s FC Substrate Output Capability Expansion Plan IBIDEN’s FC Packaging Product Shipment, 2006-2012 Shinko’s Revenue and Operating Profit Margin, 2005-2010 Shinko’s Total Liabilities and Shareholder’s Equities, 2005-2009FY Shinko’s Net Profit, 2005-2009FY Shinko’s Capital Expenditure, 2005-2009FY Shinko’s Revenue by Division, 2005-2009FY Shinko’s Product Tree Unisem’s Revenue and Gross Profit Margin, 2004-2009 Nepes’ Revenue and EBITDA, 2007-2011E Nepes’ Revenue by Division, 2008Q1-2009Q4 STS Revenue and EBITDA, 2004-2008 STS Revenue by Product, 2009Q1-2010Q4 Unimicron’s Organization Structure Unimicron’s Revenue and Gross Profit Margin, 2000-2010 Unimicron’s Plants Unimicron’s Output Capability by Product, 2007-2009 Unimicron’s Revenue by Product, 2009Q1 vs. 2009Q2 Unimicron’s Revenue by Downstream Application, 2009Q1 vs. 2009Q2 Unimicron’s Revenue by Product, 2008 vs. 2009H1 Unimicron’s Revenue by Downstream Application, 2008 vs. 2009H1 Chipbond’s Revenue and Gross Profit Margin, 2003-2010 Chipbond’s Revenue by Technology, 2006-2010 Chipbond’s Clients, 2005-2009 Revenue and Operating Profit Margin of Changjiang Electronics Technology, 2006-2009 Staff Structure of Changjiang Electronics Technology by the end of 2008 Revenue of Global Main Cell Phone Baseband Manufacturers, 2008 Packaging Technology Development Forecast of Global Main Cell Phone Baseband Manufacturers, 2008-2013 Comparison of 12 Typical Baseband Packaging Types Packaging Comparison of Typical Cell Phone Processors Packaging Technologies of Global Typical Cell Phone Processors, 2009 Comparison of 12 Typical PA Packaging Comparison of 13 Typical RF Transceivers’ Packaging Other Typical Cell Phone IC Packaging Technologies Shipment of Global Top 13 Brand Manufacturers, 2008 Top 25 Cell Phone Manufacturers in China by Output, 2008 ASE’s Top Ten Clients, 2006Q1, 2008Q1 & 2009Q2 SPIL’s Output Capacity, 2006Q1, 2007Q2&Q3 and 2009Q1&Q2 Nanya’s Circuit Board Output Capacity, 2007-2009 M&A Events of ChipMOS Output Capacity of ChipMOS Shanghai Base FC Packaging Revenue, 2006-2009FY Chipbond’s Output Capacity, 2009-2010 not available [Ocultar lista de tablas / figuras] |
||||||||||||
| Precio ** (Formato del reporte): |
libre de costos de envio **Importante: Todos los precios son netos sin impuestos. Depende del país y de su tipo de empresa para pagar los impuestos. Si usted nos da su dirección de facturación, el monto total correcto será indicado en la siguiente orden de proceso. Para más información de impuestos y precios usted nos encuentra en nuestros FAQs |
|||||||||||
| Mensaje para este reporte de investigacion de mercado: | * La cantidad facturada para este estudio se encuentra listada en $ (dolares). Su banco o su institucion financiera calculara la tasa de cambio. | |||||||||||
